Integrated Circuits for Wideband Communications and Wireless Sensor Networks
Organization Committee General
Chairs: Technical
Program Committee Chairs: Invited
Papers Chairs: Tutorial Chair:
International
Advisory Committee: Publicity
Chair / Web Master: Publication
Chair: Interactive
Forum Chair: Finance
Chairs: Exhibition
Chairs: Sponsorship
Chairs: Secretary: Local
Arrangements Chair: |
Aggressive scaling of CMOS and SiGe technologies has brought the highly-integrated RF front-ends and millimeter wave ICs into the domain of silicon technology. The high frequency performance of silicon devices is leading to a coalescing of microwave and silicon microelectronics, making ‘ubiquitous wireless’ practical and affordable. Silicon foundries providing nano-scale feature sizes continue to boom, particularly in the Asia region With this background, the workshop aims to provide a forum for exchange of information and update on latest developments in the area of radio frequency integrated circuits and integration of communication systems. Participation by the IC design community from both academia and industry is highly encouraged. Accordingly, leading edge and contemporary topics such as RFICs, OEICs, BioICs, including design, characterization, fabrication or implementation and packaging, will define the themes of the workshop. In this year’s workshop, the focus will be on RF transceiver architecture and the design of high performance transceiver blocks for emerging wideband and high-frequency communication, as well as low power wireless sensor networks applications. In addition to oral presentations and posters, distinguished leaders will be invited to deliver keynote speeches on significant trends, advancements and applications in areas related to the theme. The topics of interest include but are not limited to the following: |
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Wireless Data and Wideband Communication System ICs: UWB, WiMAX, WLAN, 802.11x, Bluetooth, MMDS, TV Tuners … RF Transceiver Architecture for Modern and future Cellular Systems: GPS, GSM, EDGE, TDMA, WCDMA, 3G, 4G … RF and Optical IC Building Blocks: LNA, Mixer, VGA, Filter, Modulator, PA, Driver, VCO, PLL, Synthesizer, ADC … Millimeter Wave ICs and Applications Modeling and CAD |
Low Power Wireless Sensor Networks and RF Identification Integrated Bio Electronics and Health Care Sensors with Wireless Connectivity Optical System IC’s and Architectures RF and Optical IC Fabrication Technologies 3D Module and heterogeneous materials and system integration SoC, SiP, Packaging, Modules, RF test and characterization |
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Electronic Paper Submissions and Deadlines A summary written in English, up to 4 A4 pages in standard IEEE format, including affiliations of authors, e-mail address of the communicating author, a 100 word abstract, and a summary bringing out the original contributions is to be submitted. The format and style of the summary should have the same layout as the final paper and should include key figures, diagrams and data. Commercial or promotional papers are strongly discouraged. Format and style for the final manuscript will be provided in the instructions to authors on our website www.ime.a-star.edu.sg/rfit2005. |
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August 22,
2005 |
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Exhibitions Exhibition of company products are solicited for the above Subject Areas. Interested parties should contact the Exhibition Chair, rfit@ime.a-star.edu.sg |
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Call for Papers |
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