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Invited Papers
| Invited Speakers |
Vijay Nair, Corporate Technology Group, Intel Corporation, USA
"Heterogeneous Wireless Communication Devices: Present and Future" |
Huei Wang, National Taiwan University, Taiwan
"Current Status and Future Trends for Si and Compound MMICs in Millimeter-Wave Regime and Related Issues for System on Chip (SoC) and/or System in Package (SiP)" |
Georg Boeck, Berlin University of Technology, Germany
"Design of RF-CMOS Integrated Circuits for Wireless Communications" |
A. Mazzanti and F. Svelto, University of Pavia, Italy
"A CMOS Sub-Harmonic Receiver for signal down-conversion at Ka Band" |
Kunihiko Iizuka, SHARP Corporation, Japan
"Integrated RF-ICs for Mobile TV Applications" |
S. T. Nicolson, E. Laskin, M. Khanpour, R. Aroca, A. Tomkins, K.H.K Yau, P. Chevalier, P. Garcia, A. Chantre, B. Sautreuil, and S.P. Voinigescu, University of Toronto, Canada and STMicroelectronics, France
"Design and Layout Techniques for CMOS and SiGe BiCMOS Transceivers Above 77 GHz"
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Stan Skafidas, University of Melbourne, Australia
"Design of 60 GHz transceiver on CMOS" |
Herbert Zirath, Chalmers University of Technology, Sweden
"Newly developed chip sets for 60 GHz radio communication systems" |
M. C. Frank Chang, UCLA, USA
"Impact of CMOS Scaling on RFIC Designs" |
Tadahiro Kuroda, Keio University, Japan,
"Wireless Proximity Communications for 3D System Integration" |
Didier BELOT, STMicro, France
"SiP vs SoC for mobile communications applications" |
James C. M. Hwang, Lehigh University, USA
"Dielectric Charging Effects in MEMS Capacitive Switches" |
Christian Enz, CSEM/EPFL
"Building Blocks for an Ultra Low-Power MEMS-based Radio" |
C. Patrick Yue, UCSB, USA
"Cell-based mm-wave IC design in scaled CMOS" |
Jenshan Lin, University of Florida, USA
"Dual-function 3D heatsink antenna for high-density 3D integration"
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Domine M.W. Leenaerts, NXP Semiconductors, the Netherlands
"WiMedia UWB technology: 480Mb/s wireless USB" |
Zhihua Wang, Tsinghua University, China
"Some Issues in Integrated Circuit Design for UHF RFID" |
Andries Scholten, NXP Semiconductors, The Netherlands
"RF noise modelling with PSP" |
Minoru Fujishima, University of Tokyo, Japan
"New Architechture for CMOS Millimeter-wave Tranceiver" |
Akira Inoue, Mitsubishi Electric Corporation, Japan
"MMIC technologies for MW and MMW applications" |
Akira Matsuzawa, Tokyo Institute of Technology, Japan
Digital-Centric RF CMOS Technology |
Luciano Boglione, University of Massachusetts, USA
RFIC Symposium History and Progress |
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