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Invited Papers

Keynotes
Thomas H. Lee, Stanford University, USA
"From Oxymoron to Mainstream: The Evolution and Future of RF CMOS"
Stefan Heinen, Fellow RF Solutions, Infineon Technologies, Germany
"Challenges for RF CMOS Integration"

Invited Speakers

Vijay Nair, Corporate Technology Group, Intel Corporation, USA
"Heterogeneous Wireless Communication Devices: Present and Future"

Huei Wang, National Taiwan University, Taiwan
"Current Status and Future Trends for Si and Compound MMICs in Millimeter-Wave Regime and Related Issues for System on Chip (SoC) and/or System in Package (SiP)"

Georg Boeck, Berlin University of Technology, Germany
"Design of RF-CMOS Integrated Circuits for Wireless Communications"

A. Mazzanti and F. Svelto, University of Pavia, Italy
"A CMOS Sub-Harmonic Receiver for signal down-conversion at Ka Band"

Kunihiko Iizuka, SHARP Corporation, Japan
"Integrated RF-ICs for Mobile TV Applications"

S. T. Nicolson, E. Laskin, M. Khanpour, R. Aroca, A. Tomkins, K.H.K Yau, P. Chevalier, P. Garcia, A. Chantre, B. Sautreuil, and S.P. Voinigescu, University of Toronto, Canada and STMicroelectronics, France
"Design and Layout Techniques for CMOS and SiGe BiCMOS Transceivers Above 77 GHz"

Stan Skafidas, University of Melbourne, Australia
"Design of 60 GHz transceiver on CMOS"

Herbert Zirath, Chalmers University of Technology, Sweden
"Newly developed chip sets for 60 GHz radio communication systems"

M. C. Frank Chang, UCLA, USA
"Impact of CMOS Scaling on RFIC Designs"

Tadahiro Kuroda, Keio University, Japan,
"Wireless Proximity Communications for 3D System Integration"

Didier BELOT, STMicro, France
"SiP vs SoC for mobile communications applications"

James C. M. Hwang, Lehigh University, USA
"Dielectric Charging Effects in MEMS Capacitive Switches"

Christian Enz, CSEM/EPFL
"Building Blocks for an Ultra Low-Power MEMS-based Radio"

C. Patrick Yue, UCSB, USA
"Cell-based mm-wave IC design in scaled CMOS"

Jenshan Lin, University of Florida, USA
"Dual-function 3D heatsink antenna for high-density 3D integration"

Domine M.W. Leenaerts, NXP Semiconductors, the Netherlands
"WiMedia UWB technology: 480Mb/s wireless USB"

Zhihua Wang, Tsinghua University, China
"Some Issues in Integrated Circuit Design for UHF RFID"

Andries Scholten, NXP Semiconductors, The Netherlands
"RF noise modelling with PSP"

Minoru Fujishima, University of Tokyo, Japan
"New Architechture for CMOS Millimeter-wave Tranceiver"

Akira Inoue, Mitsubishi Electric Corporation, Japan
"MMIC technologies for MW and MMW applications"

Akira Matsuzawa, Tokyo Institute of Technology, Japan
Digital-Centric RF CMOS Technology

Luciano Boglione, University of Massachusetts, USA
RFIC Symposium History and Progress