Professor Manos M. Tentzeris received the Diploma Degree in Electrical and Computer Engineering from the National Technical University of Athens ("Magna Cum Laude") in Greece and the M.S. and Ph.D. degrees in Electrical Engineering and Computer Science from the University of Michigan, Ann Arbor, MI and he is currently a Professor with School of ECE, Georgia Tech, Atlanta, GA. He has published more than 320 papers in refereed Journals and Conference Proceedings, 3 books and 17 book chapters. Dr. Tentzeris has helped develop academic programs in Highly Integrated/Multilayer Packaging for RF and Wireless Applications using ceramic and organic flexible materials, paper-based RFID's and sensors, Microwave MEM's, SOP-integrated (UWB, mutliband, conformal) antennas and Adaptive Numerical Electromagnetics (FDTD, Multi Resolution Algorithms) and heads the ATHENA research group (20 researchers). He is the Georgia Electronic Design Center Associate Director for RFID/Sensors research, and he has been the Georgia Tech NSF-Packaging Research Center Associate Director for RF Research and the RF Alliance Leader from 2003-2006. He was the recipient/co-recipient of the 2009 E.T.S.Walton Award from the Irish Science Foundation, the 2007 IEEE APS Symposium Best Student Paper Award, the 2007 IEEE IMS Third Best Student Paper Award, the 2007 ISAP 2007 Poster Presentation Award, the 2006 IEEE MTT Outstanding Young Engineer Award, the 2006 Asian-Pacific Microwave Conference Award, the 2004 IEEE Transactions on Advanced Packaging Commendable Paper Award, the 2003 NASA Godfrey "Art" Anzic Collaborative Distinguished Publication Award, the 2003 IBC International Educator of the Year Award, the 2003 IEEE CPMT Outstanding Young Engineer Award, the 2002 International Conference on Microwave and Millimeter-Wave Technology Best Paper Award (Beijing, CHINA), the 2002 Georgia Tech-ECE Outstanding Junior Faculty Award, the 2001 ACES Conference Best Paper Award and the 2000 NSF CAREER Award and the 1997 Best Paper Award of the International Hybrid Microelectronics and Packaging Society. He was the TPC Chair for IEEE IMS 2008 Symposium and the Chair of the 2005 IEEE CEM-TD Workshop and he is the Vice-Chair of the RF Technical Committee (TC16) of the IEEE CPMT Society. He is the founder and chair of the RFID Technical Committee (TC24) of the IEEE MTT Society and the Secretary/Treasurer of the IEEE C-RFID. He has organized various sessions and workshops on RF/Wireless Packaging and Integration, RFID's, Numerical Techniques/Wavelets, in IEEE ECTC, IMS, VTC and APS Symposia in all of which he is a member of the Technical Program Committee in the area of "Components and RF". He is the Associate Editor of IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Advanced Packaging and International Journal on Antennas and Propagation. Dr.Tentzeris was a Visiting Professor with the Technical University of Munich, Germany for the summer of 2002, where he introduced a course in the area of High-Frequency Packaging. He has given more than 50 invited talks in the same area to various universities and companies in Europe, Asia and America. He is a Senior Member of IEEE, a member of URSI-Commission D, a member of MTT-15 committee, an Associate Member of EuMA, a Fellow of the Electromagnetic Academy and a member of the Technical Chamber of Greece.